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C2030-283 exam Dumps Source : Foundations of IBM Cloud Computing Architecture V3

Test Code : C2030-283
Test cognomen : Foundations of IBM Cloud Computing Architecture V3
Vendor cognomen : IBM
: 39 existent Questions

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IBM Foundations of IBM Cloud

pricey Colleague Letter: Addition of IBM as a Cloud resource issuer to the FY 2018 BIGDATA Solicitation | killexams.com existent Questions and Pass4sure dumps

April 13, 2018

pricey Colleagues:

through this pricey Colleague missive (DCL), the countrywide Science groundwork's (NSF) Directorate for desktop and suggestions Science and Engineering (CISE) desires to notify the neighborhood that IBM has joined as one of the cloud useful resource providers for the fiscal yr (FY) 2018 vital recommendations, technologies, and Methodologies for Advancing Foundations and functions of massive statistics Sciences and Engineering (BIGDATA) application solicitation(see https://www.nsf.gov/funding/pgm_summ.jsp?pims_id=504767 for extra assistance about the software).

As historical past, NSF introduced remaining 12 months the provision of a cloud altenative as Part of the FY 2017 BIGDATA solicitation, with participation with the aid of Amazon net services (AWS), Google Cloud (GCP), and Microsoft Azure. The cloud altenative enabled tasks to request cloud substances in assist of their massive records research and training actions, mainly focusing on gigantic-scale experimentation and scalability experiences.

This option remains in spot for the FY 2018 BIGDATA solicitation, with AWS, GCP, and Microsoft Azure continuing their participation. moreover, IBM has now joined the BIGDATA program as one of the most cloud useful resource suppliers, under the identical terms and stipulations as material to any the different cloud providers. The corresponding terms and conditions are described within the FY 2018 BIGDATA software solicitation, available at https://www.nsf.gov/publications/pub_summ.jsp?ods_key=nsf18539.

Proposers might too exhaust here IBM resources to develop the total cost of cloud elements together with an annual utilization draw over the length of the tasks:

As described within the solicitation, the request for cloud supplies might subsist reviewed along with the relaxation of the concept. credit can subsist allocated either for the cloud company requested within the notion, or for equivalent substances from an option cloud provider.

Please examine the entire solicitation carefully before getting ready your thought.

Please word that the submission time confine for the FY 2018 BIGDATA solicitation is may additionally 7-14, 2018.

As noted within the application solicitation, the NSF BIGDATA software webpage discovered at https://www.nsf.gov/funding/pgm_summ.jsp?pims_id=504767 will continue to subsist up-to-date to listing any cloud providers presently taking Part in the application. As of the date of this DCL, these are Amazon, Google, Microsoft, and now IBM.

Questions concerning the BIGDATA software solicitation, including the cloud choice, may noiseless subsist directed to the cognizant program administrators listed in the solicitation.

in actual fact,Jim KuroseAssistant DirectorComputer and tips Science and Engineering


IBM taps Samsung for Chip Manufacturing | killexams.com existent Questions and Pass4sure dumps

IBM (NYSE:IBM) became one of the most few organizations nonetheless developing the manufacturing processes to construct slicing-part chips. Then, lower back in 2015, IBM accomplished the sale of its chip manufacturing property to face-on my own chip brand GLOBALFOUNDRIES. 

sadly for IBM's chip efforts -- the company nevertheless develops vigour processors for servers and Z-sequence chips for its mainframes -- GLOBALFOUNDRIES ceased edifice of cutting-side chip manufacturing technology. This left IBM in want of a current accomplice to manufacture its chip designs.

Inside an IBM computer room.

graphic source: IBM.

a short time lower back, Nikkei Asian evaluation reported that this current ally can be Taiwan Semiconductor Manufacturing enterprise (NYSE:TSM). whereas GLOBALFOUNDRIES didn't bring its own seven-nanometer manufacturing expertise, marketed as 7LP, into mass production, TSMC's own seven-nanometer technology is now in mass creation. (if you are studying this on probably the most latest iPhones or iPads, you might subsist the usage of a device powered with the aid of a TSMC seven-nanometer chip.)

fairly enough, that record was wrong, and it appears IBM is partnering with TSMC's best reform competitor in main-facet semiconductor common sense expertise: Samsung (NASDAQOTH:SSNLF). 

what is the deal?

On Dec. 20, IBM said that it "introduced an agreement with Samsung to fabricate 7-nanometer (nm) microprocessors for IBM power techniques, IBM Z and LinuxONE, excessive-performance computing (HPC) systems, and cloud offerings."

in addition, the press unlock claimed that "[today's] announcement additionally expands and extends the 15-year strategic technique expertise R&D partnership between both corporations, which, as a Part of IBM's research Alliance, contains many trade firsts such because the first NanoSheet equipment innovation for sub 5nm, the production of the trade's first 7nm examine chip and the first high-k metallic Gate foundry manufacturing."

What does this imply for IBM and Samsung?

From IBM's standpoint, the trade now has a manageable chip manufacturing companion to aid the chips that punch its techniques. closing quarter, IBM's techniques enterprise -- which the company says "comprises systems hardware and working techniques application -- generated $1.7 billion in sales, transforming into 1% year-over-year. That represented just 9% of the business's salary within the quarter. 

then again, that section is tremendous satisfactory that IBM goes to want to proceed to advocate it, and having a legitimate manufacturing associate to construct the microprocessors at the heart of those systems is vital to conserving that enterprise alive.

as far as Samsung is worried, here is incremental enterprise for its compress chip manufacturing arm. youngsters, this is via no means a game changer for Samsung. IBM's complete methods company become $1.7 billion ultimate quarter and simply over $5.4 billion during the first three quarters of 2018. If they weigh on that hasten cost for everything of 2018, it translates into about $7.2 billion in natural device income.

Samsung goes to subsist generating income handiest for the manufacture of the main processors in these programs. not best enact these methods embrace many other add-ons (chassis, punch materials, DRAM, storage, motherboards, and so on), however IBM is, naturally, marking up the raw materials prices of those programs to generate profit. 

This deal actually is rarely going so as to add one thousand million bucks or greater to Samsung's coffers and is not finally going to subsist a online game changer for Samsung or even Samsung's semiconductor enterprise (which is essentially dominated by using revenue of DRAM and NAND memories), nonetheless it may noiseless pressure incremental income and raw earnings. 

Ashraf Eassa has no spot in any of the stocks outlined. The Motley fool has no spot in any of the stocks mentioned. The Motley idiot has a disclosure coverage.


Samsung Clinches principal IBM compress for 7nm know-how | killexams.com existent Questions and Pass4sure dumps

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business had few rivals bar TSMC…

IBM has announced a contend with Samsung on the pass to observe the later manufacture 7nm (nanometer) microprocessors for IBM’s products together with its energy programs, IBM Z and LinuxONE, excessive-efficiency computing (HPC) methods, and cloud offerings, in vindication of Samsung’s dedication to the immoderate capex technology.

“The settlement combines Samsung’s business-leading semiconductor manufacturing with IBM’s high-efficiency CPU designs. This composite is being designed to drive unmatched methods performance, including acceleration, recollection and that i/O bandwidth, encryption and compression speed, as well as system scaling”, IBM said.

The deal represents Samsung’s first main compress for 7nm after committing to the technology previous this yr. It any started production in October the usage of a brand current manufacturing manner called EUV lithography.

7nm: what's it first rate For?

Samsung claims that compared to its 10nm FinFET predecessors, its 7nm know-how “significantly reduces the system complexity with fewer layers and greater yields” and additionally grants as much as a forty percent boost in enviornment effectivity with 20 percent larger performance or up to 50 percent subside punch consumption.

Gartner analyst Alan Priestley told laptop company assessment in a cognomen that he become unsurprised via the resolution. He talked about: “There’s very confined option in the sector for IBM. The option changed into in reality Samsung or TSMC. The altenative I feel is Intel’s foundry service nevertheless it’s no longer got its equal technology ready yet.”

See also: Intel beaten for First Time in 25 Years

Qualcomm and Mediatek possess postponed their 7-nanometer launches except 2019, UMC has shifted its investment into “mature” and speciality procedure nodes, and Globalfoundries has establish its drudgery within the container on indefinite hold. Intel’s equal 10nm chips are a pass far from being market-capable.

Samsung’s leading rival within the 7-nanometer box is TSMC. The trade is presently the sole producer of Apple’s A-series processors, used in iPhones, iPads, and other products.

nowadays’s announcement “expands and extends” a 15-12 months strategic R&D partnership between the two corporations which comprises “many industry firsts such as the first NanoSheet device innovation for sub 5nm, the creation of the industry’s first 7nm verify chip and the first excessive-ok metal Gate foundry manufacturing” IBM referred to.

“we are excited to extend their decade-long strategic relationship with IBM with their 7nm EUV system expertise,” observed Ryan Lee, vice chairman of Foundry advertising at Samsung Electronics, in a release late Thursday.

“This collaboration is an significant milestone for Samsung’s foundry enterprise because it signifies confidence in Samsung’s reducing-edge tall performance EUV system technology.”

Samsung is a member of the OpenPOWER basis, a vendor ecosystem facilitating the edifice of IBM punch structure-based customized servers, networking and storage for future records centers and cloud computing. Samsung is too a member of the Q network to abet enhance the figuring out of functions software in quantum computing for the trade.




Killexams.com C2030-283 Dumps and existent Questions

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C2030-283 exam Dumps Source : Foundations of IBM Cloud Computing Architecture V3

Test Code : C2030-283
Test cognomen : Foundations of IBM Cloud Computing Architecture V3
Vendor cognomen : IBM
: 39 existent Questions

worked difficult on C2030-283 books, however the entire component possess become on this test manual.
I passed the C2030-283 examination 3 days subside again, I used killexams.Com dumps for buying geared up and i should efficaciously complete the exam with a immoderate score of ninety eight%. I used it for over in keeping with week, memorized any questions and their solutions, so it possess spin out to subsist effortless for me to imprint the proper solutions inside the path of the remain exam. I thank the killexams.Com organization for supporting me with the sort of high-quality training fabric and granting success.


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hi team, ive finished C2030-283 in first strive and thanks a lot to your advantageous query bank.


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Foundations of IBM Cloud Computing Architecture V3

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5 Modern Infrastructure Trends To Watch Out for in 2019 | killexams.com existent questions and Pass4sure dumps

With the enterprise and public sector accelerating the adoption, cloud has become the current norm. From the days of on-demand provisioning of compute and storage to FPGA and GPU-based infrastructure, cloud computing has approach a long way. Cloud computing has almost reached the tipping point.

Data CenterSource: Pixabay

The innovations from hyperscale infrastructure providers love Amazon, Microsoft, Google, and IBM are going to impact enterprise data center. This trend will enable big enterprises to grasp advantages of the efficiency and performance achieved by cloud providers. With this trend, the line between on-premises infrastructure and public cloud will gain blurred.

Here are five trends of modern infrastructure to watch out for in 2019:

The rise of containers & Kubernetes in the enterprise data center

Enterprises are embracing containers at a much faster pace than expected. The thriving open source community combined with the availability of mature commercial offerings has given the confidence to enterprise customers.

Kubernetes has become the front and focus of enterprise container platform. From traditional OS vendors to modern PaaS providers, every major platform vendor has a commercial Kubernetes offering making it the current operating system of the data center.

In 2019, expect to observe a meteoric rise of Kubernetes in the enterprise. Containers will redefine the hybrid cloud by bridging the gap between legacy and modern applications and on-premises and public cloud infrastructure.

Google has announced the preview of on-prem GKE that comes with taut integration of its proven Containers as a Service (CaaS) in the public cloud – Google Kubernetes Engine. Microsoft is moving expeditiously in bringing Azure Kubernetes Service to Azure Stack private cloud platform. IBM is betting on IBM Cloud Private – a hybrid cloud platform based on Kubernetes.

Traditional PaaS has gradually transformed into a container management platform. PaaS industry leaders – Red Hat and Pivotal – possess embraced Kubernetes as the foundation of their platforms. 2019 will witness the complete transformation of PaaS into CaaS.

The availability of specialized hardware for niche workloads

During the initial days of computing, the software was written for common hardware architecture based on Intel X86 or SPARC. Eventually, Intel became the lowest common denominator for OS vendors and application vendors.

Public cloud has changed the dynamics of hardware and CPU market. To drive the scale of economy and efficiency, hyperscale providers love Amazon, Google, Microsoft, and Facebook started to build custom hardware and processors that complement Intel CPUs.

With niche workloads such as machine learning and high-performance computing becoming the key drivers of public cloud adoption, hyperscale providers are turning to custom hardware to accelerate the performance of the applications.

In 2019, they will observe the trend where custom chips will supersede generic software. The heavy lifting done by software written for virtualization, graphics, and HPC will subsist moved to purpose-built hardware that delivers massive performance and efficiency.

Field programmable gate arrays (FPGA) used in Microsoft’s Project Brainwave and proprietary accelerators such as Google Cloud TPU will become more prominent in 2019. They may even become available to power enterprise data centers.

Multi-cloud will no more subsist a buzzword

Enterprises are investing in multiple cloud platforms to reduce the risk of vendor lock-in and solitary point of failure.

Large enterprise customers are using at least two cloud providers when running mission-critical workloads. The common pattern is the exhaust of kick storage for maintaining an additional layer of redundancy. Deploying the DR site in a different cloud platform is too a common exhaust case of multi-cloud. But these patterns don't deliver the benefits of reform multi-cloud adoption.

In 2019, they will witness a trend where customers will federate multiple cloud platforms to hasten a distributed workload. They may hasten a legacy transactional database in one cloud platform while running the data warehouse in the other. As cloud providers differentiate themselves with platforms for running niche workloads, customers will elect the best of breed providers to hasten parts of their workload.

Kubernetes will evolve to become the fabric of multi-cloud. Customers targeting Kubernetes as the preferred deployment target will luxuriate in the benefits of multi-cloud along with portability.

The next phase of DevOps

Two major trends are going to impact the current DevOps model – Containers & AI.

Traditional DevOps tools were exclusively designed for provisioning, scheduling, configuring, and managing the lifecycle of virtual machines. Containers brought a different even of abstraction that eliminated the exigency to manage VMs directly. Concepts such as immutable infrastructure, infrastructure as code, and self-healing applications win traditional DevOps tools less relevant.

In 2019, they will witness a current wave of DevOps companies that deliver efficient CI/CD pipelines, better observability and security of microservices. love other areas of infrastructure, containers are any set to disrupt the DevOps market.

The application of AI to DevOps will result in AIOps that reduces the exigency for manual intervention. From anomaly detection to root occasions analysis to predictive scaling to bright monitoring, AIOps-based technology will become the smart operations tool. It may even supersede L1 and L2 advocate teams with bright automation.

AIOps will become a significant trend of 2019.

The convergence of Containers as a Service and Functions as a Service

Serverless computing is no more a buzzword. It is becoming one of the fastest growing cloud service delivery models. Amazon, Google, IBM, and Microsoft proffer serverless computing models in their respective public cloud environments.

Functions as a Service (FaaS) is one of the delivery models of serverless computing in which developers upload code snippets packaged as modular functions. These functions are invoked in response to events generated by a variety of external sources such as databases, storage containers, streams, and even user interfaces. AWS Lambda, Azure Functions, Google Cloud Functions and IBM Cloud Functions are some of the implementations in the public cloud.

In 2019, they will observe two trends – the convergence of CaaS and FaaS, and standardization of FaaS.

Serverless was the most discussed topic at KubeCon 2018 that concluded ultimate week. The industry is coming together to win Kubernetes the platform for deploying event-driven functions that are invoked in response to internal and external events. Next year, I expect to observe FaaS becoming a first-class citizen in the container world.

There will subsist efforts in defining common standards for FaaS that brings portability and interoperability of functions.


IBM Expands Strategic Partnership with Samsung to embrace 7nm Chip Manufacturing | killexams.com existent questions and Pass4sure dumps

ARMONK, N.Y., Dec. 20, 2018 — IBM today announced an agreement with Samsung to manufacture 7-nanometer (nm) microprocessors for IBM Power Systems, IBM Z and LinuxONE, high-performance computing (HPC) systems, and cloud offerings.

The agreement combines Samsung’s industry-leading semiconductor manufacturing with IBM’s high-performance CPU designs. This combination is being designed to drive unmatched systems performance, including acceleration, recollection and I/O bandwidth, encryption and compression speed, as well as system scaling. It positions IBM and Samsung as strategic partners leading the current era of high-performance computing specifically designed for AI.

“At IBM, their first priority is their clients,” said John Acocella, Vice President of Enterprise Systems and Technology progress for IBM Systems. “IBM selected Samsung to build their next generation of microprocessors because they participate their even of commitment to the performance, reliability, security, and innovation that will position their clients for continued success on the next generation of IBM hardware.”

Today’s announcement too expands and extends the 15-year strategic process technology R&D partnership between the two companies which, as Part of IBM’s Research Alliance, includes many industry firsts such as the first NanoSheet Device innovation for sub 5nm, the production of the industry’s first 7nm test chip and the first High-K Metal Gate foundry manufacturing. IBM’s Research Alliance ecosystem continues to define the leadership roadmap for the semiconductor industry.

“We are excited to expand their decade-long strategic relationship with IBM with their 7nm EUV process technology,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “This collaboration is an significant milestone for Samsung’s foundry trade as it signifies confidence in Samsung’s cutting-edge tall performance EUV process technology.”

Samsung is a member of the OpenPOWER Foundation, a vendor ecosystem facilitating the progress of IBM Power architecture-based customized servers, networking and storage for future data centers and cloud computing. Samsung is too a member of the Q Network to abet forward the understanding of applications software in quantum computing for the industry.

Source: IBM


Samsung Clinches Major IBM compress for 7nm Technology | killexams.com existent questions and Pass4sure dumps

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Company had few rivals bar TSMC…

IBM has announced a deal with Samsung that will observe the later manufacture 7nm (nanometer) microprocessors for IBM’s products including its Power Systems, IBM Z and LinuxONE, high-performance computing (HPC) systems, and cloud offerings, in vindication of Samsung’s commitment to the tall capex technology.

“The agreement combines Samsung’s industry-leading semiconductor manufacturing with IBM’s high-performance CPU designs. This combination is being designed to drive unmatched systems performance, including acceleration, recollection and I/O bandwidth, encryption and compression speed, as well as system scaling”, IBM said.

The deal represents Samsung’s first major compress for 7nm after committing to the technology earlier this year. It started production in October using a current manufacturing process called EUV lithography.

7nm: What is it generous For?

Samsung claims that compared to its 10nm FinFET predecessors, its 7nm technology “greatly reduces the process complexity with fewer layers and better yields” and too delivers up to a 40 percent multiply in district efficiency with 20 percent higher performance or up to 50 percent lower power consumption.

Gartner analyst Alan Priestley told Computer trade Review in a muster that he was unsurprised by the decision. He said: “There’s very limited altenative in the sector for IBM. The altenative was basically Samsung or TSMC. The alternative I suppose is Intel’s foundry service but it’s not got its equivalent technology ready yet.”

See also: Intel Beaten for First Time in 25 Years

Qualcomm and Mediatek possess postponed their 7-nanometer launches until 2019, UMC has shifted its investment into “mature” and speciality process nodes, and Globalfoundries has establish its drudgery in the realm on indefinite hold. Intel’s equivalent 10nm chips are some pass away from being market-ready.

Samsung’s main rival in the 7-nanometer realm is TSMC. The company is currently the sole producer of Apple’s A-series processors, used in iPhones, iPads, and other products.

Today’s announcement “expands and extends” a 15-year strategic R&D partnership between the two companies which includes “many industry firsts such as the first NanoSheet Device innovation for sub 5nm, the production of the industry’s first 7nm test chip and the first High-K Metal Gate foundry manufacturing” IBM said.

“We are excited to expand their decade-long strategic relationship with IBM with their 7nm EUV process technology,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics, in a release late Thursday.

“This collaboration is an significant milestone for Samsung’s foundry trade as it signifies confidence in Samsung’s cutting-edge tall performance EUV process technology.”

Samsung is a member of the OpenPOWER Foundation, a vendor ecosystem facilitating the progress of IBM Power architecture-based customized servers, networking and storage for future data centers and cloud computing. Samsung is too a member of the Q Network to abet forward the understanding of applications software in quantum computing for the industry.



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